flip chip

• Air lift flip chip
  气顶升倒装法
• Ic and optoelectronics packaging ; flip chip technology ; surface mount technology
  集成电路及光电子封装；倒扣芯片技术；表面贴装技术
• Current research on the reaction between solder bump and under bump metallurgy systems in flip chip
  倒装芯片中凸点与凸点下金属层反应的研究现状
• Flip chip technology has become one of the major joining technologies in electronic packaging
  摘要覆晶技术已成为电子构装中之主要接合技术之一。
• The current crowding effect and temperature distributions in flip chip solders are discussed
  本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。
• Promote the manufacture of high value - added products , e . g . wafer fabrication , flip chip technology
  -增加了高附加值产品的生产，如无线电晶片、芯片等
• As an electric current passes through , the joule heating and electromigration effects occur in the flip chip solder bumps
  当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。
• The report of determination for interface delamination propagation rate of real flip chip packages is hardly found up to now
  目前，测定实际倒装焊封装界面分层传播速率报道尚少见。
• The reliability of flip chip package was studied in this work by both experimental measurements and finite element simulations
  本文针对倒装焊封装可靠性问题进行了实验和数值模拟两方面的研究。
• Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
  完成某集成电路封装（叩焊芯片）内部实际的电气连接的焊料中的铅。